Nuvoton new ReRAM
30
Oct
2023
Nuvoton is using an innovative non-volatile memory, the ReRAM to replace flash in its newest Cortex-M-based line of products. This was developed when Nuvoton was still Panasonic Semiconduct Solutions. Fujitsu developed a 12 Mbits product last year, based on Nuvoton’s technology. ReRAM seems to be catching on with multiple startups focused on the technology, including Weebit and Crossbar. According to Nuvoton, ReRAM provides key advantages compared to traditional Flash, including fast read/write speeds, low power consumption, and superior durability. Let’s hope for success of ReRAM in the low power MCU market.
Infineon added 15 new part numbers as it created the PSoC™ 4000T series, expanding the PSoC™ 4 Cortex-M0+ based microcontrollers family. It features Infineon’s 5th Generation high-performance CAPSENSE™ capacitive sensing technology with 10x higher SNR and 10x lower consumption than previous generations of CAPSENSE™.
PSoC™ 4000T series targets low-power applications including wearable, hearable, and smart connected IoT devices. Here is the overview of the PSoC 4000T:
- 48-MHz Arm® Cortex®-M0+ CPU with single-cycle multiply
- Up to 64/8 kB of flash/RAM
- CAPSENSE™ technology; supports both, self and mutual capacitive sensing techniques with up to 16 self-capacitive inputs or 64 mutual-capacitive inputs
15 part numbers were released. There were also 7 new variants in the CY8C414x family (Auto PSoC 4S-Series).
Microchip added 78 new part numbers mostly in the ATTiny, AVR16, DSPIC33C (with the VAO suffix for Automotive support), and PIC18F.
No change.
Nuvoton released the M2L31 Series, a 72 MHz Cortex-M23 based group targeting Motor Control, PC Peripherals, Industrial Automatic, Battery Management System applications. It sports 64 to 512 Kbytes ReRAM, 40 to 168 Kbytes SRAM, 1.71V to 3.6V operating voltage, -40°C to 105°C wide operating temperature, a variety of packages choices, and high immunity characteristics by 4 kV ESD HBM and 4.4 kV EFT.
ReRAM (Resistive Random-Access Memory) is a type of non-volatile memory that achieves digital data storage by altering the resistance state of its components through the application of an external voltage. It boasts three major characteristics: fast read/write speeds, low power consumption, and superior durability, making it hailed as the next-generation embedded universal memory. Unlike embedded flash memory, ReRAM doesn’t require an page erase operation before writing, resulting in faster write speeds and a more straightforward and speedy operation similar to EEPROM. Furthermore, ReRAM consumes less energy for storing each bit compared to what is needed in flash memory. Additionally, because each storage unit can be individually set or reset, it offers greater endurance than flash memory.
The M2L31 series provides up to three Programmable Gain Amplifiers (PGA) to amplify the small voltage, three comparators in conjunction with PWM to ensure cycle-by-cycle over current limiting for increased application safety and robustness, one 24-ch high-speed 3.6 MSPS 12-bit SAR ADC, up to two 12-bit 1 MSPS DAC to provide precise voltage reference to other analog device, 12-ch 16-bit 72MHz PWM and up to 12-ch 16-bit 144MHz EPWM.
The M2L31 series includes one controller compliant with USB Type-C Rev. 2.1 and USB Power Delivery Rev. 3.0 specifications. The controller featuring USB Type-C pull-high and pull-low resistors, Dead battery and fast role swap supported, and flexible Power Delivery along with data transmission over a single cable.
The M2L31 series provides a variety of peripherals such as RTC with independent VBAT pin, up to 16 channels of PDMA, up to 16 independent capacitive touch key sensing, up to 2 sets of CAN FD controller, USB 2.0 FS OTG Host and device controllers, up to 8 sets of UART, up to 4 sets of I²C, up to 4 sets of SPI/I2S,1 set of QSPI, and 2 sets of Universal Serial Control Interfaces (USCI).
Supported packages include WLCSP 25 (2.5 mm x 2.5 mm), QFN32 (5 mm x 5 mm), LQFP48 (7 mm x 7 mm), QFN 48 (5 mm x 5 mm), WLCSP 49 (3.0 mm x 3.0 mm), LQFP64 (7 mm x 7 mm), and LQFP128 (14 mm x 14 mm).
No change.
Renesas was quite prolific this month, with 30 new RA part numbers, all variants of existing parts, 121 new products in the RL78 family mostly with new revisions of existing parts.
No change.
ST had only minor changes to its portfolio with 22 new variants across various families.
TI had a few new Cortex-M0+ from the MSPM0L/G Cortex-M0+ MCUs, but these were samples with an X prefix. 9 parts in total. The Delfino 28x got also 13 new parts, F28001xx.
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