Fall mix
30
Sep
2024
There was a good mix of new products in September with NXP, ST and TI all releasing new Cortex-M parts. NXP boosted its M33 portfolio adding to the higher end while ST chose to protect the low cost STM32C0 with higher memory variants. TI is pushing the Cortex-M0+ to the automotive market, a move we haven’t seen – yet from ST.
No significant changes this month.
Microchip added about 50 products this month, mostly for the ATSAMC/D and E with new suffixes. These suffixes enlighten the user about the package type, grade (temperature and plating), and carrier. It also carries undocumented codes, potentially related to factory calibration. Some of the custom codes make the device quite more expensive, see ATSAMC21E17A-MUT ($2.16/5k) vs. ATSAMC21E17A-MUT510 ($2.74/5k). Can calibration justify such a value differential? Email your suggestions at info@keremi.com.
No change this month.
No change this month.
NXP is beefing up its MCX A series by adding a new higher end A15x variant.
MCX A are general-purpose Cortex-M33 MCUs designed to address a wide range of applications with scalable device options, low power and intelligent peripherals. The innovative power architecture is designed to support high utilization of I/Os and power efficiency with a simple supply circuit in a smaller footprint. Designed to support more GPIO pins for additional external connections, the MCX A allows designers to utilize a smaller package, simpler board design and lower system BOM costs. See below for details.
New package variants were introduced for the MCX C (Cortex-M0+) and for the MIMXRT101/6.
On another note, NXP announced the i.MX RT700 crossover MCU family with up to five computing cores. This includes a primary Cortex-M33 running at 325 MHz, with integrated HiFi 4 DSP for more demanding DSP and audio processing tasks. It also features NXP’s eIQ Neutron NPU, enabled with the eIQ machine learning software development environment. The family scales up to a best-in-class 7.5MB of ultra-low power SRAM with zero wait-state access. The i.MX RT700 also includes an ultra-low power sense compute subsystem with a second Cortex-M33 and integrated Cadence Tensilica HiFi 1 DSP. This removes the need for an external sensor hub, reducing system design complexity, footprint and BOM costs.
Renesas introduced a couple of dozen variants of existing products.
No significant changes.
ST is bringing some performance boost to its cost-efficient STM32C0 series.
WIth up to 128Kbyte of Flash and 24Kbyte of RAM, the STM32C071 MCUs add USB Host and crystal-less Device as well as TouchGFX support. With USB on-chip, designers can easily save at least one external clock and four decoupling capacitors to cut the bill of materials and ease PCB layout. Also, having only one power-supply pair helps to simplify the PCB design, new product designs can become slimmer, trimmer, and more competitive.
The STM32C0 MCUs feature a Cortex-M0+ core and can replace legacy 8-bit or 16-bit MCUs in equipment like home appliances, simple industrial controls, power tools, and IoT devices.
32 new devices were uncovered.
TI released 46 parts, mostly for low cost M0G3x but also for the MSP430F2/4/5/6 and the F28P65 (automotive).
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