Cortex-M33 steals the show
31
Mar
2019
The Cortex-M33 seems to be catching all the attention this month with 2 companies claiming firsts with it. Dialog released the DA1469x with support for BT 5.1 precision location functions. At the same time, NXP with its LPC55S6x line features one or two Cortex-M33 manufactured in a 40nm embedded flash process. ST also showed a few dozen parts of its BT MCU devices, the STM32WB. Looking forward to see these in upcoming products.
Atmel/Microchip
There were 30 new ATTiny products mostly with SSN/SSF suffixes. These are SOIC150 8-pin 105C/125C devices.
There were 30 new ATTiny products mostly with SSN/SSF suffixes. These are SOIC150 8-pin 105C/125C devices.
Dialog
Dialog uncovered the DA1469x and is showing 4 products: DA14691, DA14695, DA14697 and DA14699. The core runs at up to 96MHz, with 384 or 512/16kB of RAM/cache and a decrypt-on-the-fly quad SPI to interface with external Flash memory. Dialog claims to have the first wireless MCU in production based on the ARM Cortex M33 processor. It supports the latest version of Bluetooth (5.1) including the Angle of Arrival and Angle of Departure features. Devices are offered in VFBGA86 (6×6 mm) and VFBGA100 (5×5 mm) packages.
Dialog uncovered the DA1469x and is showing 4 products: DA14691, DA14695, DA14697 and DA14699. The core runs at up to 96MHz, with 384 or 512/16kB of RAM/cache and a decrypt-on-the-fly quad SPI to interface with external Flash memory. Dialog claims to have the first wireless MCU in production based on the ARM Cortex M33 processor. It supports the latest version of Bluetooth (5.1) including the Angle of Arrival and Angle of Departure features. Devices are offered in VFBGA86 (6×6 mm) and VFBGA100 (5×5 mm) packages.
Infineon
No change.
No change.
Microchip
50 new PIC32MZ were found with /GJX suffixes but not much more indication. 37 PIC1x parts were added in addition to 42 unusual dsPIC33CK parts with suffixes including M4, M5.
50 new PIC32MZ were found with /GJX suffixes but not much more indication. 37 PIC1x parts were added in addition to 42 unusual dsPIC33CK parts with suffixes including M4, M5.
Nordic
No change.
No change.
Nuvoton
No change.
No change.
NXP
There was a roaster of new parts this month coming from NXP. NXP claims to have the first Cortex-M33 for Mass Market with the new LPC55S6x (sampling status) although ST has the STM32L56 in preview already. The LPC55S6x uses a 40nm Embedded Flash process and includes SRAM PUF-based root of trust and provisioning, real-time execution from encrypted images (internal flash), and asset protection with Arm TrustZone-M. It also integrates a power management IC (DC-DC) and dedicated co-processors for signal processing and cryptographic acceleration.
The first parts run at 100MHz and integrate one or two cores with 320 or 640 kB of Flash and 2 USB controllers (1 HS and one FS both with PHY).
Another improvement to the roadmap is the LPC54018/LPC54S018 that embeds either 2 or 4MB of Flash in a SiP, connecting memory and MCU through the Quad SPI interface. The S version includes additional cryptographic functions.
There was a roaster of new parts this month coming from NXP. NXP claims to have the first Cortex-M33 for Mass Market with the new LPC55S6x (sampling status) although ST has the STM32L56 in preview already. The LPC55S6x uses a 40nm Embedded Flash process and includes SRAM PUF-based root of trust and provisioning, real-time execution from encrypted images (internal flash), and asset protection with Arm TrustZone-M. It also integrates a power management IC (DC-DC) and dedicated co-processors for signal processing and cryptographic acceleration.
The first parts run at 100MHz and integrate one or two cores with 320 or 640 kB of Flash and 2 USB controllers (1 HS and one FS both with PHY).
Another improvement to the roadmap is the LPC54018/LPC54S018 that embeds either 2 or 4MB of Flash in a SiP, connecting memory and MCU through the Quad SPI interface. The S version includes additional cryptographic functions.
Renesas
The Synergy S5D3 adds a new lower tier to the S5 MCU series for applications that do not require on-chip graphic acceleration or Ethernet connectivity. The 4 parts are built on a 40nm process, run at 100MHz, with enhanced security including AES, 3DES/ARC4, RSA/DSA/ECC and SHA1/SHA224/SHA256/MD5.
The Synergy S5D3 adds a new lower tier to the S5 MCU series for applications that do not require on-chip graphic acceleration or Ethernet connectivity. The 4 parts are built on a 40nm process, run at 100MHz, with enhanced security including AES, 3DES/ARC4, RSA/DSA/ECC and SHA1/SHA224/SHA256/MD5.
SiliconLabs
A set of EFR32BG1 products for bluetooth were removed due to insufficient Flash or RAM memory to support new Bluetooth Low energy features and bug fixes.
A set of EFR32BG1 products for bluetooth were removed due to insufficient Flash or RAM memory to support new Bluetooth Low energy features and bug fixes.
Spansion/Cypress
Cypress has only minor changes this month.
Cypress has only minor changes this month.
ST Microelectronics
ST showed 32 parts (preview status) for the STM32WB, a Dual-core, multi-protocol wireless MCU. The STM32WB is based on a 64MHz Cortex‐M4 aided by a 32MHz network Cortex-M0+ and supports BT5 and 802.15.4 wireless standards. Interestingly, it can run Bluetooth™ 5 and OpenThread wireless protocols concurrently. On the peripheral side, we see a crystal-less USB 2.0 FS, LCD driver, and AES256.
ST showed 32 parts (preview status) for the STM32WB, a Dual-core, multi-protocol wireless MCU. The STM32WB is based on a 64MHz Cortex‐M4 aided by a 32MHz network Cortex-M0+ and supports BT5 and 802.15.4 wireless standards. Interestingly, it can run Bluetooth™ 5 and OpenThread wireless protocols concurrently. On the peripheral side, we see a crystal-less USB 2.0 FS, LCD driver, and AES256.
Texas Instruments
TI is beefing up its FRAM MSP430FR2 value line with 32 new parts MSP430FR215x, MSP430FR235x, MSP430FR247x, MSP430FR267x.
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TI is beefing up its FRAM MSP430FR2 value line with 32 new parts MSP430FR215x, MSP430FR235x, MSP430FR247x, MSP430FR267x.
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